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TEA5767HN Datasheet

  • TEA5767HN

  • Low-power FM stereo radio

  • Philips

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Philips Semiconductors
TEA5767HN
Low-power FM stereo radio for handheld applications
18. Soldering
18.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for 鏗乶e pitch
SMDs. In these situations re鏗俹w soldering is recommended.
18.2 Re鏗俹w soldering
Re鏗俹w soldering requires solder paste (a suspension of 鏗乶e solder particles, 鏗倁x and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for re鏗俹wing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical re鏗俹w peak temperatures range from 215
擄C
to 270
擄C
depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
鈥?/div>
below 225
擄C
(SnPb process) or below 245
擄C
(Pb-free process)
鈥?/div>
for all BGA, HTSSON..T and SSOP..T packages
鈥?/div>
for packages with a thickness
鈮?/div>
2.5 mm
鈥?/div>
for packages with a thickness < 2.5 mm and a volume
鈮?/div>
350 mm
3
so called
thick/large packages.
鈥?/div>
below 240
擄C
(SnPb process) or below 260
擄C
(Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
18.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was speci鏗乧ally
developed.
If wave soldering is used the following conditions must be observed for optimal results:
鈥?/div>
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
鈥?/div>
For packages with leads on two sides and a pitch (e):
鈥?/div>
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
TEA5767HN_4
漏 Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 04 鈥?20 February 2006
34 of 39

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