TEA5767HN Datasheet

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Philips Semiconductors

TEA5767HN

Low-power FM stereo radio for handheld applications

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

If wave soldering is considered, then the package must be placed at a 45擄 angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

de鏗乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is de鏗乶itely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on 鏗俥x foil. However, the image sensor package can be mounted by the client on a 鏗俥x foil by

using a hot bar soldering process. The appropriate soldering pro鏗乴e can be provided on request.

Hot bar soldering or manual soldering is suitable for PMFP packages.

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TEA5767HN_4

Product data sheet

Rev. 04 鈥?20 February 2006

36 of 39

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