PACKAGE OPTION ADDENDUM
www.ti.com
22-Feb-2005
PACKAGING INFORMATION
Orderable Device
5962-87658012A
5962-8765801PA
5962-9554901NXDR
TLC372CD
TLC372CDR
TLC372CP
TLC372CPSR
TLC372CPW
TLC372CPWLE
TLC372CPWR
TLC372ID
TLC372IDR
TLC372IP
TLC372MD
TLC372MDR
TLC372MFKB
TLC372MJG
TLC372MJGB
TLC372MP
TLC372MUB
TLC372QD
TLC372QDR
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
LCCC
CDIP
SOIC
SOIC
SOIC
PDIP
SO
TSSOP
TSSOP
TSSOP
SOIC
SOIC
PDIP
SOIC
SOIC
LCCC
CDIP
CDIP
PDIP
CFP
SOIC
SOIC
Package
Drawing
FK
JG
D
D
D
P
PS
PW
PW
PW
D
D
P
D
D
FK
JG
JG
P
U
D
D
Pins Package Eco Plan
(2)
Qty
20
8
8
8
8
8
8
8
8
8
8
8
8
8
8
20
8
8
8
10
8
8
2000
75
2500
50
75
2500
1
1
1
50
1
75
2500
1
1
2500
75
2500
50
2000
150
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
None
None
None
None
None
None
None
None
Lead/Ball Finish
MSL Peak Temp
(3)
POST-PLATE Level-NC-NC-NC
A42 SNPB
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42 SNPB
A42 SNPB
Call TI
A42 SNPB
CU NIPDAU
CU NIPDAU
Level-NC-NC-NC
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-1-220C-UNLIM
Level-1-220C-UNLIM
Call TI
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-NC-NC-NC
Level-1-220C-UNLIM
Level-3-245C-168 HR
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-1-220C-UNLIM
Level-1-220C-UNLIM
POST-PLATE Level-NC-NC-NC
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Addendum-Page 1