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ISL54400, ISL54401, ISL54402

Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)

D

A

B

L10.2.1x1.6A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC

PACKAGE

MILLIMETERS

SYMBOL

MIN

0.45

-

NOMINAL

0.50

-

0.127 REF

0.15

2.05

1.55

0.20

2.10

1.60

0.50 BSC

0.20

0.35

-

0.40

10

4

1

0

-

12

-

0.45

0.25

2.15

1.65

MAX

0.55

0.05

NOTES

-

-

-

5

-

-

-

-

-

2

3

3

4

Rev. 3 6/06

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on D and E side,

respectively.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Maximum package warpage is 0.05mm.

8. Maximum allowable burrs is 0.076mm in all directions.

9. Same as JEDEC MO-255UABD except:

No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm

"L" MAX dimension = 0.45 not 0.42mm.

10. For additional information, to assist with the PCB Land Pattern

Design effort, see Intersil Technical Brief TB389.

2.50

1.75

6

INDEX AREA

2X

2X

0.10 C

N

E

1

0.10 C

2

A

A1

TOP VIEW

A3

b

0.10 C

0.05 C

SEATING PLANE

A1

SIDE VIEW

(DATUM A)

PIN #1 ID

1

2

NX L

N

(DATUM B)

N-1

e

3

(ND-1) X e

BOTTOM VIEW

C

L

NX (b)

5

SECTION "C-C"

C C

e

(A1)

NX b

5

A

C

D

E

e

k

L

N

4xk

Nd

Ne

胃

0.10 M C A B

0.05 M C

L

TERMINAL TIP

FOR ODD TERMINAL/SIDE

b

0.05 MIN

L

2.00

0.80

0.275

0.10 MIN

DETAIL 鈥淎鈥?PIN 1 ID

0.50

0.25

LAND PATTERN 10

14

FN6240.3

July 12, 2006

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