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MCP6546/6R/6U/7/8/9

8-Lead Plastic Dual In-line (P) 鈥?300 mil Body (PDIP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E1

D

2

n

1

偽

E

A

A2

c

L

A1

尾

eB

B1

p

B

MIN

MAX

MAX

Number of Pins

Pitch

Top to Seating Plane

A

.140

.170

4.32

Molded Package Thickness

A2

.115

.145

3.68

Base to Seating Plane

.015

A1

Shoulder to Shoulder Width

E

.300

.313

.325

8.26

Molded Package Width

E1

.240

.250

.260

6.60

Overall Length

D

.360

.373

.385

9.78

Tip to Seating Plane

L

.125

.130

.135

3.43

c

Lead Thickness

.008

.012

.015

0.38

Upper Lead Width

B1

.045

.058

.070

1.78

Lower Lead Width

B

.014

.018

.022

0.56

eB

Overall Row Spacing

摟

.310

.370

.430

10.92

偽

Mold Draft Angle Top

5

10

15

15

尾

Mold Draft Angle Bottom

5

10

15

15

*

Controlling Parameter

摟

Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010鈥?(0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

Units

Dimension Limits

n

p

INCHES*

NOM

8

.100

.155

.130

MILLIMETERS

MIN

NOM

8

2.54

3.56

3.94

2.92

3.30

0.38

7.62

7.94

6.10

6.35

9.14

9.46

3.18

3.30

0.20

0.29

1.14

1.46

0.36

0.46

7.87

9.40

5

10

5

10

漏

2006 Microchip Technology Inc.

DS21714E-page 21

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