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MCP6546/6R/6U/7/8/9

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

E1

p

D

2

B

n

1

偽

c

蠁

A

A2

F

尾

Units

Dimension Limits

Number of Pins

Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint (Reference)

Foot Angle

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

n

p

A

A2

A1

E

E1

D

L

F

蠁

c

B

偽

尾

.016

-

.030

.000

MIN

L

A1

INCHES

NOM

8

MAX

MIN

MILLIMETERS*

NOM

8

0.65 BSC

-

.043

.037

.006

-

0.75

0.00

4.90 BSC

3.00 BSC

3.00 BSC

.031

8擄

.009

.016

15擄

15擄

0.40

0擄

0.08

0.22

5擄

5擄

0.60

0.95 REF

-

-

-

-

-

-

8擄

0.23

0.40

15擄

15擄

0.80

-

0.85

-

1.10

0.95

0.15

MAX

.026 BSC

.033

-

.193 BSC

.118 BSC

.118 BSC

.024

.037 REF

0擄

.003

.009

5擄

5擄

.006

.012

-

-

*

Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

JEDEC Equivalent: MO-187

Drawing No. C04-111

Revised 07-21-05

漏

2006 Microchip Technology Inc.

DS21714E-page 23

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