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MCP6546/6R/6U/7/8/9

5-Lead Plastic Small Outline Transistor (OT) (SOT23)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

E1

B

p1

D

n

1

偽

c

蠁

A

A2

尾

L

A1

Units

Dimension Limits

Number of Pins

Pitch

Outside lead pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Foot Angle

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

n

p

p1

A

A2

A1

E

E1

D

L

蠁

c

B

偽

尾

.035

.035

.000

.102

.059

.110

.014

0

.004

.014

0

0

MIN

INCHES*

NOM

6

.038 BSC

.075 BSC

.046

.043

.003

.110

.064

.116

.018

5

.006

.017

5

5

.057

.051

.006

.118

.069

.122

.022

10

.008

.020

10

10

0.35

0

0

0.90

0.90

0.00

2.60

1.50

2.80

0.35

0

0.09

MAX

MIN

MILLIMETERS

NOM

6

0.95 BSC

1.90 BSC

1.18

1.10

0.08

2.80

1.63

2.95

0.45

5

0.15

0.43

5

5

1.45

1.30

0.15

3.00

1.75

3.10

0.55

10

0.20

0.50

10

10

MAX

*

Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

JEITA (formerly EIAJ) equivalent: SC-74A

Drawing No. C04-120

Revised 09-12-05

DS21714E-page 20

漏

2006 Microchip Technology Inc.

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MCP6548-E/MS相關(guān)型號(hào)PDF文件下載

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