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I/O Card Interface Connectors

NX Series

3. ESD Secure

Thermoplastic molded covers assures insulation

of the connections and shields from ESD.

4. Secure Latching

A built-in latch assures correct and secure

mating of connector.

5. Reliable Conductor Termination

Reliable termination of conductors

accomplished by proven IDC termination.

is

6. Sequential Mating

The 0.8mm pitch contacts are engaging the

corresponding parts in sequence: Ground-

Power & Signal

7. Rugged Construction

sFeatures

1. Low Profile

Protorusion above the PCB board is only 2.9mm, and the

connectors can be mounted to type I and II I/O cards.

Securely attached to the board with optional

screws.

8. Card Frame Kits

Available as a separate part number.

2. EMI/RFI protection

Full metal shielding. Shield connects first, ahead of

contacts.

9. Secure Attachment to Frame Kit.

Compliant mounting bracket attaches the

connectore directly to the frame kit.

sApplications

Used with I/O cards, portable personal computers,and the external connections of various small-sized portable

terminals.

sSpecifications

Current rating 0.5 A

Ratings

Voltage rating 125 V AC

Item

1. Insulation resistance

2. Withstanding voltage

3. Contact resistance

4. Vibration

Operating temperature

Operating humidity

-30莽 to +70莽 (Note 1) Storage temperature range -10莽 to +60莽 (Note 2)

95% R.H. or less

(No condensation)

Specification

250 M ohms min.

No flashover or insulation breakdown.

40 m ohms max.

No electrical discontinuity of 10碌s or

more

100 V DC

300 V AC / 1 minute

100 mA

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,

2 hours in each of the 3 directions.

96 hours at temperature of 60莽 and humidity of 90% to 95%

-55莽, 30 min./15 to 30莽, within 5 min/85莽, 30 min

/15

to 35莽, within 5 min, for 5 cycles

3000 cycles

Storage humidity range

Conditions

40 to 70% (Note 2)

5. Humidity (Steady state)

Insulation resistance: 100 M ohms min.

6. Temperature cycle

7. Durability

(Insertion/withdrawal)

8. Resistance to

Soldering heat

No damage, cracks, or parts looseness.

60 m ohms max.

No deformation of components affecting

Reflow: At the recommended temperature profile

performance.

Manual soldering: 300莽 for 3 seconds

Note 1: Includes temperature rise caused by current flow.

Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature

Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during

transportation.

B8

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